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Precision Grinding and Polishing Machine  electronics for optics, metals, ceramics, glassPrecision Grinding and Polishing Machine  electronics for optics, metals, ceramics, glassPrecision Grinding and Polishing Machine  electronics for optics, metals, ceramics, glassPrecision Grinding and Polishing Machine  electronics for optics, metals, ceramics, glass

Precision Grinding and Polishing Machine electronics for optics, metals, ceramics, glass

    The precision grinding and polishing machine is a device used in the precision machining field, primarily for high-precision grinding and polishing of workpieces to achieve flatness, smoothness, deburring, and oxide layer removal. It is widely used in industries such as electronics, optics, metals, ceramics, glass, and others, particularly for workpieces that require high surface finish and dimensional precision, such as semiconductor materials, optical lenses, hard disk heads, and medical instruments.

The precision grinding and polishing machine is a device used in the precision machining field, primarily for high-precision grinding and polishing of workpieces to achieve flatness, smoothness, deburring, and oxide layer removal. It is widely used in industries such as electronics, optics, metals, ceramics, glass, and others, particularly for workpieces that require high surface finish and dimensional precision, such as semiconductor materials, optical lenses, hard disk heads, and medical instruments.

 

Product Overview:

The CY-UNPOL-2001 precision grinding and polishing machine has three processing stations. It is a floor-standing grinding and polishing machine that can grind and polish large-size samples. It is used for grinding and polishing samples of crystals, ceramics, metals, glass, rock samples, mineral samples, PCB boards, infrared optical materials (such as zinc selenide, zinc sulfide, silicon, germanium and other crystals), refractory materials, composite materials and other materials. It is one of the ideal grinding and polishing equipment for scientific research and production experiments. This machine is equipped with a Ø508mm grinding and polishing disc and three processing stations. It can be used for grinding and polishing discs ≤Ø160mm or rectangular planes with a diagonal length of ≤160mm. During the grinding process, the three processing stations can swing left and right at a certain frequency, and at the same time push the carrier block to swing left and right. The carrier block rotates while revolving with the grinding disc, so that the sample moves irregularly, making the surface quality of the sample uniform after grinding. The carrier block equipped with the grinding and polishing machine is a precision cylindrical metal block with high flatness and parallelism, which makes the surface of the sample after grinding also have high flatness, and will not chamfer the edge of the sample. It is especially suitable for samples with high edge requirements.

 

Product Features:

High-precision rotary chuck.

The spindle and the rotating disk are coaxial with high precision.

The spindle automatically rises and falls, which is convenient for multi-size grinding and polishing; the spindle can be infinitely adjusted.

Equipped with a timed polishing function, making polishing smarter.

Optional automatic dripper is available for easier grinding and polishing.

 

Purchase Information:

If you are interested in our automatic precision grinding and polishing machine, please contact us for more information and quotation.

Tel: +86 18516380382

Email: Jimmy@cysitech.com

Contact: Jimmy Hao

WeChat: +86 18516380382

WhatsApp: +86 13939946898

 

Technical Parameter:

Parameter name

Parameter description

Product name

Precision grinding and polishing machine

Product model

CY-UNPOL-2001

Working voltage

A220V, 50/60Hz

Total power

1.7kW

Grinding disc diameter

Φ508mm (20 inches)

Grinding disc speed

10-90r/min

Sample disc diameter

Φ160mm (6 inches), thickness 35mm

Repairing disc ring

Outer diameter Φ196mm, inner diameter Φ160.5mm, thickness 35mm

Swing arm bracket

One every 120°, a total of three

Number of workstations (swing mechanism)

3 stations

Bracket swing speed gear

10-30 gears (reference speed: 5.5-13.5 times/minute)

Transmission mechanism motor

Variable frequency motor, 1.5kW, 220V

Product size

820*1180*945mm(LWH)

 

Main components

Part name

Component Description

Spindle

The core component that drives the grinding or polishing disc to rotate. The accuracy directly affects the stability of the surface quality of the machined surface

Grinding disc/polishing disc

Carrying grinding or polishing media

Carrying disc

Fixed samples

Grinding liquid/polishing liquid supply system

Used for cooling, lubrication, cleaning and helping to remove waste chips generated during the grinding process

Random accessories

Grinding disc, polishing disc, carrier disc, grinding powder, paraffin stick

User manual

Standard

 

Application Fields:

Electronics Industry: Used for processing chips, semiconductor materials, disks, hard drives, etc., to improve surface quality.

Optical Industry: Used for surface processing of optical elements like lenses and optical components to enhance optical performance.

Jewelry and Watch Industry: Used for precision polishing of metals, gemstones, etc., to enhance their appearance and shine.

Automotive and Aerospace: Used for surface treatment of metal parts such as engine components and turbine blades to improve part performance.

Medical Devices: Used for precision polishing of medical instruments to ensure compliance with hygiene and usage standards.

 Application Case: Using the Precision Grinding and Polishing Machine to Grind and Polish Ceramic Substrates》

Process Steps:

1. Pre-treatment (Remove Surface Dirt and Contaminants)
Objective: Clean the surface of the ceramic substrate, removing oils, dust, contaminants, or any substances that could affect the grinding and polishing process.
Steps:

Clean the substrate surface with a cleaning agent (such as ethanol or acetone).

Use ultrasonic cleaning equipment for thorough cleaning.

Rinse with deionized water and wipe with non-woven or soft cloth to avoid leaving water marks.

 

2. Coarse Grinding Stage (Remove Larger Materials)
Objective: Remove larger defects and uneven areas on the ceramic substrate's surface, flatten the surface, and reduce roughness.
Steps:

Select the appropriate grinding disc and grinding liquid: Use coarser grinding discs (such as 200-800 grit) along with water-based grinding liquid or diamond grinding liquid.

Set grinding parameters: Adjust the spindle speed and worktable pressure, usually requiring higher pressure to remove more material.

Perform coarse grinding: Place the ceramic substrate on the worktable and grind it with the grinding disc. This process removes most of the rough material, scratches, and uneven regions on the surface.

 

3. Intermediate Grinding Stage (Fine Grinding)
Objective: Further reduce the roughness of the ceramic substrate's surface, perform fine grinding, and prepare the surface for polishing.
Steps:

Select finer grinding discs and grinding liquids: Use finer discs (such as 1000-2000 grit) and fine-particle diamond or alumina grinding liquids.

Adjust grinding parameters: Adjust the worktable pressure and grinding disc speed to ensure even material removal.

Perform fine grinding: Continue grinding the ceramic substrate under moderate pressure to further remove surface irregularities and flatten the surface.

 

4. Polishing Stage (Enhance Surface Finish)
Objective: Improve the surface finish of the ceramic substrate to achieve a mirror-like effect and reduce surface roughness.
Steps:

Select polishing disc and polishing liquid: Use soft polishing discs (such as fabric or sponge) and specialized polishing liquids (such as alumina or silica) for surface polishing.

Set polishing parameters: Adjust the polishing machine's speed, pressure, and liquid supply. At this stage, lower pressure and higher speed are needed to reduce surface scratches and achieve a smooth surface.

Perform polishing: During polishing, use lower pressure and appropriate speed to achieve a mirror-like surface on the ceramic substrate.
Note: To prevent material deformation or cracking due to excessive heat, intermittent cooling may be necessary, using cooling fluids or air flow to cool the ceramic substrate.

 

5. Cleaning and Drying
Objective: Remove any residual polishing liquid, waste material, or contaminants from the surface to ensure the workpiece is clean and undamaged.
Steps:

Rinse the ceramic substrate with deionized water to remove all polishing liquid and waste.

Use compressed air to dry the substrate, or place the ceramic substrate in an oven for low-temperature drying to ensure the surface is clean and free of watermarks.

 

6. Inspection and Quality Control
Objective: Ensure that the surface of the ceramic substrate meets the desired precision and quality standards.
Steps:

Inspect the surface quality using optical microscopes, surface roughness instruments, etc., to ensure there are no scratches, cracks, or other defects.

Check the surface finish and geometry to confirm that they meet the design requirements.

If necessary, surface roughness measurements (e.g., Ra values) can be used for precise control.

 

 

 

 

 


Contact Us
  • E-mail: cysi@cysi.wang
  • Tel: +86 371 5519 9322
  • Fax: +86 371 8603 6875
  • Add: No. 820, 8th Floor, 1st Unit, 9th Block, Cuizhu Street, High-Tech Zone, Zhengzhou, Henan, China




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