Metallographic Grinding and Polishing Machine to Grind and Polish Ceramic Substrates

The metallographic grinding and polishing machine is a precision processing device mainly used for high-precision grinding and polishing of workpieces' surfaces, achieving smoothness, flatness, deburring, and removal of oxide layers. It is widely used in industries such as electronics, optics, metals, ceramics, glass, and more, particularly for workpieces that require extremely high surface finish and dimensional accuracy, such as semiconductor materials, optical lenses, hard disk heads, and medical devices. 

Product Overview:

CY-UNPOL-1210 metallographic grinding and polishing machine is a manual grinding and polishing machine designed and developed by our company for various universities, research institutes and metallographic laboratories. It is mainly used for grinding and polishing various metallographic specimens, and can also grind and polish other types of non-metallic materials, such as ceramics, glass, PCB boards, infrared optical materials (such as zinc selenide, zinc sulfide, silicon, germanium and other crystals), rock samples, mineral samples, refractory materials, composite materials and organic polymer materials. CY-UNPOL-1210 metallographic grinding and polishing machine uses a Ø300mm aluminum grinding and polishing disc, which not only has excellent rigidity and internal compoundness, but also can obtain a higher linear speed at the same speed, thereby improving the efficiency of specimen production. The grinding and polishing speed is infinitely adjustable, the pressure is manually controlled, the operation is simple, and the use is convenient. During the grinding process, tap water can be directly connected for cooling. The installation of sandpaper or polishing pad can be installed by pressing ring or magnetic adsorption. It is easy to load and unload, and different installation methods can be selected according to personal needs. 

Product Features:

High Temperature Control: Equipped with a precise temperature control system to ensure the stability of the sintering process.

Atmosphere Control: Can operate in a vacuum or specific atmospheres (e.g., inert gases, oxygen, etc.) to prevent oxidation or other atmospheric influences during sintering.

Multi-Stage Heating: Features a multi-stage heating system to ensure uniform and controllable temperature gradients, achieving the best sintering results.

Thermal Insulation: Made with high-quality insulation materials to reduce heat loss and improve temperature uniformity inside the furnace. 

Purchase Information:

If you are interested in our metallographic grinding and polishing machine, please feel free to contact us for more information and pricing.
Phone: +86 18516380382
Email: Jimmy@cysitech.com
Contact Person: Jimmy Hao
WeChat: +86 18516380382
WhatsApp: +86 13939946898 

Technical Parameter:

Main components:

Application Fields:

Electronics Industry: Used for processing chips, semiconductor materials, disks, hard drives, etc., to improve surface quality.

Optical Industry: Used for surface processing of optical elements like lenses and optical components to enhance optical performance.

Jewelry and Watch Industry: Used for precision polishing of metals, gemstones, etc., to enhance their appearance and shine.

Automotive and Aerospace: Used for surface treatment of metal parts such as engine components and turbine blades to improve part performance.

Medical Devices: Used for precision polishing of medical instruments to ensure compliance with hygiene and usage standards.

Application Case: 《Using the Precision Grinding and Polishing Machine to Grind and Polish Ceramic Substrates》 

Process Steps:

1. Pre-treatment (Remove Surface Dirt and Contaminants)
Objective: Clean the surface of the ceramic substrate, removing oils, dust, contaminants, or any substances that could affect the grinding and polishing process.
Steps:

Clean the substrate surface with a cleaning agent (such as ethanol or acetone).

Use ultrasonic cleaning equipment for thorough cleaning.

Rinse with deionized water and wipe with non-woven or soft cloth to avoid leaving water marks.

2. Coarse Grinding Stage (Remove Larger Materials)
Objective: Remove larger defects and uneven areas on the ceramic substrate's surface, flatten the surface, and reduce roughness.
Steps:

Select the appropriate grinding disc and grinding liquid: Use coarser grinding discs (such as 200-800 grit) along with water-based grinding liquid or diamond grinding liquid.

Set grinding parameters: Adjust the spindle speed and worktable pressure, usually requiring higher pressure to remove more material.

Perform coarse grinding: Place the ceramic substrate on the worktable and grind it with the grinding disc. This process removes most of the rough material, scratches, and uneven regions on the surface.

3. Intermediate Grinding Stage (Fine Grinding)
Objective: Further reduce the roughness of the ceramic substrate's surface, perform fine grinding, and prepare the surface for polishing.
Steps:

Select finer grinding discs and grinding liquids: Use finer discs (such as 1000-2000 grit) and fine-particle diamond or alumina grinding liquids.

Adjust grinding parameters: Adjust the worktable pressure and grinding disc speed to ensure even material removal.

Perform fine grinding: Continue grinding the ceramic substrate under moderate pressure to further remove surface irregularities and flatten the surface.

4. Polishing Stage (Enhance Surface Finish)
Objective: Improve the surface finish of the ceramic substrate to achieve a mirror-like effect and reduce surface roughness.
Steps:

Select polishing disc and polishing liquid: Use soft polishing discs (such as fabric or sponge) and specialized polishing liquids (such as alumina or silica) for surface polishing.

Set polishing parameters: Adjust the polishing machine's speed, pressure, and liquid supply. At this stage, lower pressure and higher speed are needed to reduce surface scratches and achieve a smooth surface.

Perform polishing: During polishing, use lower pressure and appropriate speed to achieve a mirror-like surface on the ceramic substrate.
Note: To prevent material deformation or cracking due to excessive heat, intermittent cooling may be necessary, using cooling fluids or air flow to cool the ceramic substrate.

5. Cleaning and Drying
Objective: Remove any residual polishing liquid, waste material, or contaminants from the surface to ensure the workpiece is clean and undamaged.
Steps:

Rinse the ceramic substrate with deionized water to remove all polishing liquid and waste.

Use compressed air to dry the substrate, or place the ceramic substrate in an oven for low-temperature drying to ensure the surface is clean and free of watermarks.

6. Inspection and Quality Control
Objective: Ensure that the surface of the ceramic substrate meets the desired precision and quality standards.
Steps:

Inspect the surface quality using optical microscopes, surface roughness instruments, etc., to ensure there are no scratches, cracks, or other defects.

Check the surface finish and geometry to confirm that they meet the design requirements.

If necessary, surface roughness measurements (e.g., Ra values) can be used for precise control.