Automatic Precision Grinding and Polishing Machine to Grind and Polish Ceramic Substratesc

The precision grinding and polishing machine is a device used in the precision machining field, primarily for high-precision grinding and polishing of workpieces to achieve flatness, smoothness, deburring, and oxide layer removal. It is widely used in industries such as electronics, optics, metals, ceramics, glass, and others, particularly for workpieces that require high surface finish and dimensional precision, such as semiconductor materials, optical lenses, hard disk heads, and medical instruments.

Product Overview:

CY-UNPOL-1502 automatic precision grinding and polishing machine is used for grinding and polishing samples of crystals, ceramics, metals, glass, rock samples, mineral samples, PCB boards, infrared optical materials (such as zinc selenide, zinc sulfide, silicon, germanium and other crystals), refractory materials, composite materials and other materials. It is one of the ideal grinding and polishing equipment for scientific research and production experiments. This machine is equipped with a Φ381mm grinding and polishing disc and three processing stations, which can be used for grinding and polishing discs ≤Φ110mm or rectangular planes with a diagonal length of ≤110mm. During the grinding process, the two processing stations can swing left and right at a certain frequency, and at the same time push the carrier block to swing left and right. The carrier block rotates while revolving with the grinding disc, so that the sample moves irregularly, so that the surface quality of the sample after grinding is uniform. The carrier block equipped with the grinding and polishing machine is a precision cylindrical metal block with high flatness and parallelism, so that the surface of the sample after grinding also has high flatness, and will not chamfer the edge of the sample. It is especially suitable for samples with high edge requirements.

Product Features:

Ultra-flat polishing disc (flatness is less than 0.0025mm per 25mm×25mm).

Ultra-precision rotating axis (pallet end jump is less than 0.012mm).

Three processing stations are provided.

The spindle rotation adopts stepless speed control, and a digital display is provided to display the number of revolutions in real time.

Equipped with a timer, the working time can be accurately controlled (between 0-300h).

Optional automatic drip feeder or circulation pump makes grinding and polishing more convenient and quick.

Purchase Information:

If you are interested in our automatic precision grinding and polishing machine, please contact us for more information and quotation.

Tel: +86 18516380382

Email: Jimmy@cysitech.com

Contact: Jimmy Hao

WeChat: +86 18516380382

WhatsApp: +86 13939946898

Technical Parameter:

Main components:

Application Fields：

Electronics Industry: Used for processing chips, semiconductor materials, disks, hard drives, etc., to improve surface quality.

Optical Industry: Used for surface processing of optical elements like lenses and optical components to enhance optical performance.

Jewelry and Watch Industry: Used for precision polishing of metals, gemstones, etc., to enhance their appearance and shine.

Automotive and Aerospace: Used for surface treatment of metal parts such as engine components and turbine blades to improve part performance.

Medical Devices: Used for precision polishing of medical instruments to ensure compliance with hygiene and usage standards.

Application Case: 《Using the Precision Grinding and Polishing Machine to Grind and Polish Ceramic Substrates》

Process Steps:

1. Pre-treatment (Remove Surface Dirt and Contaminants)
Objective: Clean the surface of the ceramic substrate, removing oils, dust, contaminants, or any substances that could affect the grinding and polishing process.
Steps:

Clean the substrate surface with a cleaning agent (such as ethanol or acetone).

Use ultrasonic cleaning equipment for thorough cleaning.

Rinse with deionized water and wipe with non-woven or soft cloth to avoid leaving water marks.

2. Coarse Grinding Stage (Remove Larger Materials)
Objective: Remove larger defects and uneven areas on the ceramic substrate's surface, flatten the surface, and reduce roughness.
Steps:

Select the appropriate grinding disc and grinding liquid: Use coarser grinding discs (such as 200-800 grit) along with water-based grinding liquid or diamond grinding liquid.

Set grinding parameters: Adjust the spindle speed and worktable pressure, usually requiring higher pressure to remove more material.

Perform coarse grinding: Place the ceramic substrate on the worktable and grind it with the grinding disc. This process removes most of the rough material, scratches, and uneven regions on the surface.

3. Intermediate Grinding Stage (Fine Grinding)
Objective: Further reduce the roughness of the ceramic substrate's surface, perform fine grinding, and prepare the surface for polishing.
Steps:

Select finer grinding discs and grinding liquids: Use finer discs (such as 1000-2000 grit) and fine-particle diamond or alumina grinding liquids.

Adjust grinding parameters: Adjust the worktable pressure and grinding disc speed to ensure even material removal.

Perform fine grinding: Continue grinding the ceramic substrate under moderate pressure to further remove surface irregularities and flatten the surface.

4. Polishing Stage (Enhance Surface Finish)
Objective: Improve the surface finish of the ceramic substrate to achieve a mirror-like effect and reduce surface roughness.
Steps:

Select polishing disc and polishing liquid: Use soft polishing discs (such as fabric or sponge) and specialized polishing liquids (such as alumina or silica) for surface polishing.

Set polishing parameters: Adjust the polishing machine's speed, pressure, and liquid supply. At this stage, lower pressure and higher speed are needed to reduce surface scratches and achieve a smooth surface.

Perform polishing: During polishing, use lower pressure and appropriate speed to achieve a mirror-like surface on the ceramic substrate.
Note: To prevent material deformation or cracking due to excessive heat, intermittent cooling may be necessary, using cooling fluids or air flow to cool the ceramic substrate.

5. Cleaning and Drying
Objective: Remove any residual polishing liquid, waste material, or contaminants from the surface to ensure the workpiece is clean and undamaged.
Steps:

Rinse the ceramic substrate with deionized water to remove all polishing liquid and waste.

Use compressed air to dry the substrate, or place the ceramic substrate in an oven for low-temperature drying to ensure the surface is clean and free of watermarks.

6. Inspection and Quality Control
Objective: Ensure that the surface of the ceramic substrate meets the desired precision and quality standards.
Steps:

Inspect the surface quality using optical microscopes, surface roughness instruments, etc., to ensure there are no scratches, cracks, or other defects.

Check the surface finish and geometry to confirm that they meet the design requirements.

If necessary, surface roughness measurements (e.g., Ra values) can be used for precise control.