CY-50A precision grinding and polishing controller is referred to as grinding and polishing controller. It is mainly used to control the flatness and parallelism of the surface of the sample being ground, so that the sample after grinding and polishing has high dimensional accuracy and excellent surface quality.
CY-50A precision grinding and polishing controller is referred to as grinding and polishing controller. It is mainly used to control the flatness and parallelism of the surface of the sample being ground, so that the sample after grinding and polishing has high dimensional accuracy and excellent surface quality. The grinding and polishing controller is made of high-quality stainless steel materials, with beautiful appearance and exquisite manufacturing technology. It is mainly suitable for UNIPOL-802 grinding and polishing machine. CY-50A precision grinding and polishing controller is an indispensable precision instrument for grinding and polishing workpieces, especially for small-sized thin samples with high surface quality requirements. The special sample carrier of the grinding and polishing controller is connected to the controller with threads. The sample is mounted on the sample carrier in the form of adhesion. The sample carrier has a diameter of no more than 50mm and a thickness of no more than 10mm.
Product model: CY-50A
CY-50A precision grinding and polishing controller is referred to as grinding and polishing controller. It is mainly used to control the flatness and parallelism of the surface of the sample being ground, so that the sample after grinding and polishing has high dimensional accuracy and excellent surface quality. The grinding and polishing controller is made of high-quality stainless steel materials, with beautiful appearance and exquisite manufacturing technology. It is mainly suitable for UNIPOL-802 grinding and polishing machine. CY-50A precision grinding and polishing controller is an indispensable precision instrument for grinding and polishing workpieces, especially for small-sized thin samples with high surface quality requirements. The special sample carrier block of the grinding and polishing controller is connected to the controller with threads. The sample is mounted on the sample carrier block in the form of adhesion. The sample carrier block carries a sample with a diameter not greater than 50mm and a thickness not greater than 10mm.。
Performance specifications and basic configurations | |
key feature | The parallelism and flatness of the surface of the ground sample can be strictly controlled, and the control accuracy is high. The grinding process can be used with a digital thickness gauge to observe the grinding amount of the sample at any time, especially for the sample grinding with high surface parallelism and flatness and sample thickness requirements. |
technical parameters
| ● Sample plate diameter: Ø52mm |
product specification
| Size: Outer diameter 89mm, height 154mm |
standard fittings | Counterweight (total 400g) |
optional accessory | Counterweight (25g, 50g) |
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