CY-50 precision grinding and polishing controller is used for precise thinning of sheet samples, pre-setting the thickness that needs to be reduced, and real-time observation of the thinned thickness, accurate grinding amount, easy to operate.
CY-50 precision grinding and polishing controller is used for precise thinning of sheet samples, pre-setting the thickness that needs to be reduced, and real-time observation of the thinned thickness, accurate grinding amount, easy to operate.
Product model: CY-50
Installation dimensions: 110mm x 90mm x 160mm
Release time: 2019-09-17
CY-50 precision grinding and polishing controller is used for precise thinning of sheet samples, pre-setting the thickness that needs to be reduced, and real-time observation of the thinned thickness, accurate grinding amount, easy to operate.
Performance specifications and basic configurations | |
technical specification | ● Observed minimum grinding: 0.001mm |
product standard | Size: 110mm×90mm×160mm |
Copyright © Zhengzhou CY Scientific Instrument Co., Ltd. All Rights Reserved Update cookies preferences
| Sitemap | Technical Support: 
