CY-100A precision grinding and polishing controller, referred to as grinding and polishing controller, is mainly used to control the flatness and parallelism of the surface of the polished sample, so that the sample after grinding and polishing has high dimensional accuracy and good quality surface state.
CY-100A precision grinding and polishing controller, referred to as grinding and polishing controller, is mainly used to control the flatness and parallelism of the surface of the polished sample, so that the sample after grinding and polishing has high dimensional accuracy and good quality surface state. Grinding and polishing control instrument is made of high-quality stainless steel material, beautiful appearance, exquisite manufacturing technology, mainly suitable for UNIPOL-1202, UNIPOL-1502 grinding and polishing machine, is an indispensable precision grinding and polishing equipment for workpiece grinding and polishing. It is especially suitable for the grinding of wafer samples, large circular samples with high requirements for surface parallelism and flatness. The special load block of CY-100A precision grinding and polishing controller is connected with the controller with thread, and the sample loading method is vacuum adsorption, and it is equipped with a digital thickness measuring instrument, which can monitor the thickness of the sample in real time. The diameter of the bearing sample is no more than 103mm and the thickness is no more than 13mm, and has the advantages of high process repeatability.
Product model: CY-100A
CY-100A precision grinding and polishing controller, referred to as grinding and polishing controller, is mainly used to control the flatness and parallelism of the surface of the polished sample, so that the sample after grinding and polishing has high dimensional accuracy and good quality surface state. Grinding and polishing control instrument is made of high-quality stainless steel material, beautiful appearance, exquisite manufacturing technology, mainly suitable for UNIPOL-1202, UNIPOL-1502 grinding and polishing machine, is an indispensable precision grinding and polishing equipment for workpiece grinding and polishing. It is especially suitable for the grinding of wafer samples, large circular samples with high requirements for surface parallelism and flatness. The special load block of CY-100A precision grinding and polishing controller is connected with the controller with thread, and the sample loading method is vacuum adsorption, and it is equipped with a digital thickness measuring instrument, which can monitor the thickness of the sample in real time. The diameter of the bearing sample is no more than 103mm and the thickness is no more than 13mm, and has the advantages of high process repeatability
Performance specifications and basic configurations | |
main features | The parallelism and flatness of the surface of the ground sample can be strictly controlled, and the control accuracy is high. The grinding process can be used with a digital thickness gauge to observe the grinding amount of the sample at any time, especially for the grinding of wafer samples with high surface parallelism and flatness and sample thickness |
technical parameters | ● Sample plate diameter: Ø103mm |
product standard
| Dimensions: Outer diameter 146mm, height 266mm |
standard fittings | ● Vacuum pump |
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