Double-sided grinding and polishing machine is mainly used for double-sided precision grinding and polishing of quartz wafers, sapphire, ceramics, glass, metal and other sheet materials. This machine adopts a worm gear reducer as the transmission mechanism, and realizes the rotation of the upper, middle and lower axes at different speeds and directions through the gear set, so that the upper and lower grinding and polishing discs and the middle sun gear produce speed difference and relative movement, and the sample is placed in the inner hole of the sample-carrying planetary gear driven by the sun gear, so as to grind and polish it on both sides.
Double-sided grinding and polishing machine is mainly used for double-sided precision grinding and polishing of quartz wafers, sapphire, ceramics, glass, metal and other sheet materials. This machine adopts a worm gear reducer as the transmission mechanism, and realizes the rotation of the upper, middle and lower axes at different speeds and directions through the gear set, so that the upper and lower grinding and polishing discs and the middle sun gear produce speed difference and relative movement, and the sample is placed in the inner hole of the sample-carrying planetary gear driven by the sun gear, so as to grind and polish it on both sides.
The double-sided grinding and polishing machine can choose to grind the sample with a grinding disc and abrasive, or it can choose to grind the sample with a polishing disc and sandpaper. The polishing disc with sandpaper is to stick the sandpaper on the polishing film and then adsorb the polishing film on the polishing disc for grinding and polishing. Multiple samples can be ground at the same time, with high grinding and polishing efficiency, which is suitable for grinding a large number of samples or small batch production in factories.
If you are interested in our double-sided grinding and polishing machine, please contact us for more information and quotation.
·Tel: 185 3800 8121
·Email: Lily@cysitech.com
·Contact: Zhao Xiaoli
·Wechat: 15617818691
Performance indicators and basic configuration | |
Installation conditions | ● This equipment is required to be used at an altitude of less than 1000m, a temperature of 25℃±15℃, and a humidity of 55%Rh±10%Rh. ● Water: The equipment is equipped with a water inlet and a water outlet, and you need to connect to tap water and drainage by yourself. ● Electricity: AC220V 50Hz, must be well grounded ● Gas: None ● Workbench: Dimensions 800mm×600mm×700mm, load-bearing capacity of more than 200kg ● Ventilation device: Not required |
Main features | ● The speed is controlled by manually adjusting the frequency of the inverter. ● It can perform double-sided grinding and polishing on 4 substrates with a size of Ø2" at the same time. ● It can perform double-sided thinning of thin slices. ● It is an ideal tool for double-sided grinding and polishing of Si, Ge, and oxide single crystal substrates. |
Technical parameters | ● Power supply: 220V 50Hz ● Power: 550W ● Grinding and polishing disc: Ø225mm ● Grinding and polishing disc speed: steplessly adjustable from 0-72rpm ● Maximum sample size: Ø50mm (max), thickness ≤15mm ● Upper grinding and polishing disc weight: 3.5kg |
Product dimensions | 650mm×500mm×580mm |
Product weight | 80kg |
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