Multi-point mechanical pressure grinding and polishing machine

CY-UNIPOL-800M multi-point mechanical pressure grinding and polishing machine uses three-point mechanical spring pressure. Under the action of the pressure spring, the top column presses the sample in the carrier plate onto the rotating grinding and polishing plate, so that the sample is ground and polished under a certain pressure as the plate moves, thereby realizing the positioning and grinding of the sample. UNIPOL-800M multi-point mechanical pressure grinding and polishing machine also has a special mechanical support arm grinding and polishing station, which can be used for grinding and polishing of easy-to-cleave and easy-to-break materials. During the grinding and polishing process of the sample, the gravity carrier plate with the sample fixed is ground and polished with the swing of the mechanical swing arm, and it also rotates at the same time. The scratches on the surface of the ground sample are uniform and easy to polish. This machine is mainly used in the field of material research, and is widely used in the automatic grinding and polishing of metal, ceramics, glass, infrared optical materials (such as zinc selenide, zinc sulfide, silicon, germanium and other crystals), rock samples, mineral samples, composite materials, polymer materials and other material samples in laboratories of colleges and universities, scientific research institutes, as well as small-scale production in factories. UNIPOL-800M multi-point mechanical pressure grinding and polishing machine is a dual-purpose pressure grinding and polishing machine that meets the grinding conditions of most materials.

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